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Cooling Methods For Power Semiconductor Devices And Device Mounting Between Cooling Fins

Cooling Methods For Power Semiconductor Devices And Device Mounting Between Cooling Fins

To radiate generated by power dissipation in a semiconductor device, a cooling measure must be taken, because natural heat radiation from the device case is insufficient, and the junction temperature exceeds the allowable limit of the device. Normally, either self-cooling, air-cooling, water-cooling, or oil-cooling methods are adopted. Described in article is how to select cooling fins and how to set a device between the cooling fins, when an air-cooling method is adopted.

Problems regarding thermal cooling are kin to those of an electrical circuit, and the resistance to the heat flow (thermal resistance) must be taken into consideration.

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