Organize and Share your Electronics the way you want. Sign-Up for a free account now. It takes only 30 seconds!
Hot rods keep the die cool
Clemens Valens @ elektormagazine.com shows us a new IC Package that keeps the IC cool.
Texas Instruments’ HotRod QFN is a thermally enhanced plastic package with solder lands on all sides as well as power buses for enhanced current carrying capability. Inside the package the die is mounted on a copper lead frame which eliminates the power wire bonds, improving electrical and thermal performance. This technique also improves application efficiency and minimizes package parasitic radiation.