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Design Considerations for High Power Module (HPM)

Design Considerations for High Power Module (HPM)

Fairchild’s High Power Module (HPM) solution offers higher reliability, efficiency, and power density to improve performance and reduces size and weight compared to a discrete solution. It also provides simpler repair and maintenance and design. The market trend in industrial power systems; such as photo-voltaic inverters, welding machines, and uninterruptible power supplies; is rapidly moving toward the module approach. Fairchild’s leading power semiconductor products in the market include 600 V / 650 V field-stop IGBTs, 650 V / 1200 V field-stop trench IGBTs, 600 V / 650 V super-junction MOSFETs and fast / soft recovery diodes. Fairchild has now launched the High Power Module (HPM) solution with leading power devices. This application note introduces HPM products and shows the differences between module vs. discrete solutions, describes considerations and guidance for PCB layout design, and explains how to design and use HPMs properly and efficiently.

 

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