Sjaak has published a new build, the STM32/GD32F103 QFN32 breakout board:
Uptill now I used 0603 sized resistors and capacitors but for this project I switched to 0402 to save a few mm on the board. I have soldered many challenging chip packages so I felt confident. The technique is the same as for bigger sized devices: flux the area generous, hold the device with tweezers, solder one pad with fresh soldered iron and move the device into the molten solder puddle, retract the soldering iron and watch the solder joint cool down. If the solder joint is solid solder the other side too. I suggest using a fine (curved) tweezer and lots of lighting on your workarea. If you are a bit older as I am using a loupe or magnifying glass. Still use flux as much as possible. Never expected but the micro USB connector gave me (several) headaches to get it soldered properly.
Project info at smdprutser.nl
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