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Hot rods keep the die cool

Hot rods keep the die cool

Clemens Valens @ elektormagazine.com shows us a new IC Package that keeps the IC cool.

Texas Instruments’ HotRod QFN is a thermally enhanced plastic package with solder lands on all sides as well as power buses for enhanced current carrying capability. Inside the package the die is mounted on a copper lead frame which eliminates the power wire bonds, improving electrical and thermal performance. This technique also improves application efficiency and minimizes package parasitic radiation.



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