DirectFET® is a surface mount semiconductor technology designed primarily for board-mounted power applications. It eliminates unnecessary elements of packaging that contribute to higher inductance and resistance, both thermal and electrical, so that its power capabilities exceed those of comparably sized packages.
The growing DirectFET range includes various can sizes and device outlines. There are ‘plus’ variants that use thinner dies to improve electrical performance and efficiency. There are PbF variants, pre-soldered with a tin-silver-copper alloy (Sn96.5 Ag3.0 Cu0.5) to improve performance with lead-free pastes and identified by a PbF suffix after the part number (for example, IRF6618PbF). There are also variants qualified for the automotive industry, which have a gate marker of AU instead of.
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